Single-shot encapsulation
US11171099B2 · kind B2 · utility
0Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jul 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier. An encapsulant is deposited around the semiconductor die and pillar bumps while the semiconductor die remains on the carrier. The encapsulant covers an active surface of the semiconductor die between the pillar bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.