Patent · US Active

Solder ball dimension management

US11171103B2 · kind B2 · utility

0Cited by

7References

20Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Jason J. Bjorgaard · Rochester, US
Layne A. Berge · Rochester, US
John R. Dangler · Rochester, US
Matthew S. Doyle · Chatfield, US
Thomas W. Liang · Rochester, US
Kyle Schoneck · Rochester, US
Matthew A. Walther · Rochester, US

Key dates

Filing date	Jan 6, 2020
Grant date	Nov 9, 2021
Priority date	—
Expiry date	Jan 30, 2040

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A solder ball assembly can include a first spring element having a first shape and formed from a first elastic electrically conductive material. The solder ball assembly can also include a second spring element having a second shape and formed from a second elastic electrically conductive material. The second spring element is mechanically attached to the first spring element to form a spring assembly. The solder ball can be configured to enclose the spring assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.