Wafer-level methods for manufacturing uniform layers of material on optoelectronic modules
US11171249B2 · kind B2 · utility
0Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2018 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jul 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.