Micro device and structure thereof
US11171271B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Sep 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure with micro device includes a substrate, at least one micro device, and at least one holding structure. The micro device includes an epitaxial structure and an overcoat layer. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connecting the top surface and the bottom surface. The overcoat layer includes a contact portion and an extension portion. The contact portion covers the peripheral surface and the bottom surface of the epitaxial structure. The extension portion connects the contact portion and extends in a direction away from the peripheral surface. The holding structure includes at least one connecting portion, at least one sacrificial portion and at least one holding portion. The connecting portion is disposed on the top surface of the epitaxial structure and the extension portion of the overcoat layer. The sacrificial portion connects the connecting portion and the holding portion. A portion of the sacrificial portion contacts the extension portion to define a predetermined fracture region. The holding portion connects the sacrificial portion and extends onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.