Thin-film thermocouple probe and method of preparing same
US11171276B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2020 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Dec 10, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thin-film thermocouple probe includes a columnar substrate, a tungsten-26% rhenium film and an indium oxide (In2O3) film. A side surface of the columnar substrate is provided with a first straight groove and a second straight groove. The tungsten-26% rhenium film is arranged on a front end surface of the columnar substrate and in the first straight groove. The indium oxide film is arranged on the front end surface of the columnar substrate and in the second straight groove. The indium oxide film on the front end surface of the columnar substrate is connected to the tungsten-26% rhenium film on the front end surface of the columnar substrate. A first metal lead wire is connected to the tungsten-26% rhenium film, and a second metal lead wire is connected to the indium oxide film. A method of preparing the thin-film thermocouple probe is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.