Laser integration techniques
US11171464B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Dec 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02469
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.