Multipiece element storage package and multipiece optical semiconductor device
US11172571B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Feb 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A multipiece element storage package of the present disclosure includes: a mother substrate which includes first element storage package regions, second element storage package regions, a dummy region, a first surface, and a second surface; a first stem electrode disposed in a part of the dummy region which part is in the first surface; and a second stem electrode disposed on the second surface. The first element storage package regions and the second element storage package regions each include a frame body disposed on the first surface, a first wiring conductor disposed on the first surface, and including one end located inside the frame body and the other end connected to the first stem electrode, and a second wiring conductor including one end which is located on the first surface and inside the frame body and the other end which is connected to the second stem electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.