BGA component masking dam and a method of manufacturing with the BGA component masking dam
US11172580B2 · kind B2 · utility
333Cited by
12References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2017 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jun 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1377
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The proposed masking dam protects ball grid array integrated circuit components from conformal coating overflow, preventing joint breakage and thermal mismatch. The masking dam includes a frame with an integrated seal, a cover, and a fastening mechanism. The frame is sealed to a circuit board surround a component, the cover is attached to the frame, and the masking dam is secured to protect the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.