Mounting apparatus, for mounting at least one heat dissipating electrical device, optionally including a heat sink body for solid, gas and fluid heat exchange, and circuit board assembly providing interface between circuits
US11172597B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 26, 2020 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jun 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K2211/03
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first supporting element, e.g. a PCB, may have opposed sides. A heat sink body is mounted on one side of the first supporting element, and having peripheral surface(s) for heat dissipating electrical device. A first circuit includes the heat dissipating electrical device(s) mounted and operates at a first voltage level. At least one circuit board assembly is mounted on the other side of the first supporting element, and extends from a first end to a second end. It has a first end connector at the first end, for connecting the first end of the circuit board assembly to the first circuit, and providing a signal interface between the first circuit operating at the first voltage level and a second circuit operating at a second voltage level different or equal to the first voltage level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.