Wire bender with self aligned removable bend pin assembly
US11173538B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Aug 2, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21F1/006
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device for bending wire includes a first plate with upper and lower surfaces and a center aperture extending therebetween. A cavity is formed in the upper surface that includes opposing sidewalls with a separation that decreases as they extend towards the center aperture and decreases as they extend up from a bottom surface of the cavity. A pin assembly disposed in the cavity includes a second plate having a pin extending from a top surface and having opposing side surfaces with a separation that decreases as they extend towards the center aperture and decreases as they extend up toward the top surface. A shaft extends through the center aperture and terminates in a bend head having a wire aperture and first and second bend surfaces adjacent the wire aperture. A first motor is configured to rotate the first plate about the shaft in opposing first and second rotational directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.