Method for bonding using one-component epoxy adhesive mixtures
US11173672B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2019 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | May 16, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B11/006
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Adhesive bonds are applied by mixing two adhesives with different properties and dispensing them to form bondlines between substrate pairs. The adhesives are then thermally cured and cooled. Varying the mix ratio permits one to vary the properties of the adhesive mixture so formed for use in bonding many different substrate pairs. The process allows potentially infinite variations of adhesive properties between those of the respective starting adhesives, simply by varying the mix ratio. The invention is especially adapted for use in manufacturing settings in which adhesives are to be applied in multiple places, but differing adhesive properties are needed among the various bonding areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.