Package level thermal gradient sensing
US11174153B2 · kind B2 · utility
2Cited by
7References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2019 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Aug 29, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0292
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microelectromechanical (MEMS) device may be coupled to a dielectric material at an upper planar surface or lower planar surface of the MEMS device. One or more temperature sensors may be attached to the dielectric material layer. Signals from the one or more temperature sensors may be used to determine a thermal gradient along on axis that is normal to the upper planar surface and the lower planar surface. The thermal gradient may be used to compensate for values measured by the MEMS device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.