Resin composition and article made therefrom
US11174386B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Dec 17, 2019 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Jul 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A resin composition includes: (A) a vinyl-containing polyphenylene ether resin; (B) a resin of Formula (1); and (C) an inorganic filler. Moreover, also provided is an article made from the resin composition described above, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dissipation factor, comparative tracking index, X-axis thermal expansion coefficient, and temperature coefficient of dielectric constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.