Cu-based microcrystal alloy and preparation method thereof
US11174533B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Jul 2, 2018 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Sep 28, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C30/02
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The disclosure relates to a Cu-based microcrystal alloy and a preparation method thereof. Through being measured in percentage by mass, the Cu-based microcrystal alloy provided by the disclosure includes 20 to 30 percent of Mn, 0.01 to 10 percent of Al, 5 to 10 percent of Ni, 0.3 to 1.5 percent of Ti, 0 to 1.5 percent of Zr, 0.05 to 2 percent of Si and 45 to 74.64 percent of Cu.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.