Electroforming system and method
US11174564B2 · kind B2 · utility
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38References
22Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 31, 2018 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | May 15, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroforming system and method for electroforming a component includes an electroforming reservoir with a housing with at least one inlet and at least one outlet, and at least one anode chamber within the housing and fluidly coupled to the at least one inlet. An anode can be located within the at least one anode chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.