Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating

US11174566B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Philipp Wachter · Berlin, DE
• Stefan Kretschmer · Berlin, DE

Key dates

• Filing date: May 31, 2018
• Grant date: Nov 16, 2021
• Expiry date: May 31, 2038

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D3/58
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Aqueous acidic copper electroplating bath comprising: copper ions; at least one acid; halide ions; at least one sulfur containing compound selected form the group consisting of sodium 3-mercaptopropylsulfonate, bis(sodiumsulfopropyl)disulfide, 3-(N,N-dimethylthiocarbamoyl)-thiopropanesulfonic acid or the respective sodium salt thereof and mixtures of the aforementioned; at least one amine reaction product of diethylamine with epichlorohydrin or an amine reaction product of isobutyl amine with epichlorohydrin or mixtures of these reaction products; at least one ethylene diamine compound selected from the group having attached EO-PO-block polymers, attached EO-PO-block polymers and sulfosuccinate groups and mixtures thereof; at least one aromatic reaction product of benzylchloride with at least one polyalkylenimine and a method for electrolytically depositing of a copper coating using the electroplating bath.