High-frequency layered testing probe
US11175311B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | May 10, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07342
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high-frequency testing probe is disclosed. The probe includes a layered probe substrate having a first and second PCB, as well as first and second conducting traces disposed on opposite sides of the substrate. The probe substrate has an ungrounded differential region including two probe tips coupled to the traces, a grounded differential region, and a decoupled differential region including two probe connectors coupled to the traces. The probe also includes a ground plane between the two PCBs and between the two traces in the decoupled and grounded differential regions. In the ungrounded differential region, the first and second traces form a first differential transmission pair having a differential impedance. In the grounded differential region, the first and second traces form a second differential transmission pair having the differential impedance. The probe connectors are configured to couple to one of a vector network analyzer and a time domain reflectometer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.