Thermal simulation for management controller development projects
US11175708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2016 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Nov 28, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Certain aspects direct to systems and methods for platform simulation for development projects of a management controller, such as a baseboard management controller (BMC). The management controller stores a firmware module and a simulator module. The firmware module is supposed to receive thermal output signals from cooling zones of a computing device. The simulator module is a software implemented module used to simulate the cooling zones, by generating the thermal output signals of the cooling zones based on configuration data stored in a data store, and sending the simulated thermal output signals to the firmware module for development and testing purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.