Apparatus and method for manufacturing plurality of electronic circuits
US11177145B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2018 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Jun 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller having a removable surface portion; and transferring said ICs from the first roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.