Vertical transistor device comprising a two-dimensional (2D) material positioned in a channel region of the device and methods of making such vertical transistor devices
US11177182B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
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Key dates
| Filing date | Jan 30, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Feb 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0195
Abstract
One illustrative vertical transistor device disclosed herein includes a channel region comprising at least one layer of a two-dimensional (2D) material, a bottom source/drain region, a top source/drain region and a gate structure positioned all around at least the at least one layer of a two-dimensional (2D) material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.