Semiconductor device and method of manufacturing the same
US11177263B2 · kind B2 · utility
0Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Mar 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/716
Abstract
A semiconductor device includes a lower electrode on a substrate, a capacitor dielectric layer on the lower electrode, and an upper electrode on the capacitor dielectric layer. The capacitor dielectric layer includes a base layer on the lower electrode and a dielectric particle layer in at least a portion of the base layer. The base layer includes a first dielectric material, and the dielectric particle layer extends at least partially continuously along a thickness direction of the capacitor dielectric layer and includes a second dielectric material different from the first dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.