Solid-state image pickup apparatus, method of manufacturing solid-state image pickup apparatus, and electronic apparatus
US11177300B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2016 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Mar 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83104
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A size reduction of an image pickup module by using resin molding, including a reduction in height, area, or the like thereof is achieved in an actual product. Provided is a module, including a substrate; a semiconductor component in which a first surface of a semiconductor device manufactured by chip-size packaging is provided and fixed along a plate-shaped translucent member, and a second surface of the semiconductor device is fixed with the second surface caused to face the substrate; a frame portion made of resin and formed on the substrate to surround the semiconductor component; and an interposition member which is made of resin and with which a gap between the semiconductor component and the substrate is filled. The interposition member is connected and fixed to the frame portion to be integrated therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.