Driving backplane, method for manufacturing the same, and display device
US11177425B2 · kind B2 · utility
1Cited by
0References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 23, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Mar 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a driving backplane, a method for manufacturing the same, and a display device. The driving backplane includes: a substrate; and a bonding layer located on a side of the substrate and configured to bond with a plurality of Micro LEDs arranged in an array, wherein the bonding layer comprises a bonding metal layer and a conductive protection layer that are stacked sequentially along a direction away from the substrate, an orthographic projection of the conductive protection layer on the substrate substantially coinciding with an orthographic projection of the bonding metal layer on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.