Substrate with stepped profile for mounting transmitter optical subassemblies and an optical transmitter or transceiver implementing same
US11177887B2 · kind B2 · utility
1Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2020 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Jan 8, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4284
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure is generally directed to a stepped profile for substrates that support “on board” optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.