Flexible substrate, electronic device, and method for manufacturing electronic device
US11178764B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 25, 2018 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Dec 25, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.