Etching for bonding polymer material to a metal surface
US11178781B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2018 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Dec 8, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24545
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.