Apparatus for increasing heat dissipation capacity of a DIN rail mounted enclosure
US11178791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2013 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Aug 30, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.