Manufacturing method of glass substrate having holes, manufacturing method of interposer substrate, and method for forming hole in glass substrate
US11179809B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 4, 2019 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Jan 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/15
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.