Patent · US Active

Printhead die assembly

US11179933B2 · kind B2 · utility

0Cited by

10References

6Claims

0Family size

Assignee

HP SCITEX LTD. · IL

Inventors

Ken Vandenberghe · Corvallis, US
Alon Navon · Holon, IL
Ronny Tuttnauer · Netanya, IL

Key dates

Filing date	Nov 15, 2019
Grant date	Nov 23, 2021
Priority date	—
Expiry date	Nov 15, 2039

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41J2202/19
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A method may include positioning first and second printhead die within a die carrier, using a registration pin of the die carrier to align the first and second printhead die and fixing the position of the first and second printhead die within the die carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.