Cleaning formulation comprising a solvent additive
US11180716B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2018 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Jul 26, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/14
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning formulation has from 10 to 99 wt % water, from 0.8 to 40 wt % surfactant, optionally other additives, and from 0.2 to 20 wt % of a solvent additive of formula (I): R1—O-(AO)n—C(═O)—R2 (I) where R1 is C3 to C12 alkyl, AO is an alkylene oxide group selected from an ethylene oxide group, a propylene oxide group and a butylene oxide group. At least one AO group in the solvent additive is an ethylene oxide group. The solvent additive has a water solubility of less than 1 wt % in deionised water at 20° C. and the surfactant enables the solvent additive to dissolve and/or disperse in the cleaning formulation. In a method of cleaning an oily or waxy soil from a hard surface, the solvent additive is applied to the hard surface and optionally rinsed with water. The solvent additive is used in a cleaning formulation to improve the percentage soil removal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.