Mount attachment for an electronic device
US11181230B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2020 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | May 29, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16M2200/08
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
An attachment mechanism for mounting an electronic device to a surface including a mounting plate configured to attach to the surface, the mounting plate having at least one projection, and a base configured to releasably couple to the mounting plate. The base may include a first biasing member, and a first arm pivotably coupled to the base and biased toward a first direction by the first biasing member, the first arm configured to interlock with the at least one projection when the base is coupled to the mounting plate. The base may further include a release mechanism coupled to the first arm such that actuation of the release mechanism when the base is coupled to the mounting plate in a secured engagement causes movement of the first arm in a second direction to disengage the first arm from the at least one projection to enable detachment of the base from the mounting plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.