Projection exposure method and projection exposure apparatus for microlithography
US11181826B2 · kind B2 · utility
0Cited by
2References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 10, 2020 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Aug 10, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/706
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A projection exposure method and apparatus are disclosed for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask under the control of an operating control system of a projection exposure apparatus, part of the pattern lying in an illumination region is imaged onto the image field on the substrate with the aid of a projection lens, wherein all rays of the projection radiation contributing to the image generation in the image field form a projection beam path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.