Metal dual interface card
US11182662B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 10, 2018 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Jan 10, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07722
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.