Thin-film crystalline structure with surfaces having selected plane orientations
US11183215B1 · kind B1 · utility
1Cited by
4References
19Claims
0Family size
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Key dates
| Filing date | Jul 29, 2019 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Jul 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32136
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film structure (e.g., a near-field transducer), includes a first surface parallel to a substrate on which the thin film structure is deposited and two other surfaces orthogonal to the first surface. The first surface and the two other surfaces have respective first, second, and third selected plane orientations with respective first, second, and third atomic packing factors. The first, second, and third selected plane orientations are selected to maximize an average of the first, second, and third atomic packing factors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.