Multilayered electronic component
US11183333B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 2020 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Jun 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body including dielectric layers, and first and second internal electrodes alternately stacked in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, a resistor disposed on the second surface, a via electrode exposed to the second surface and connecting the second internal electrode and the resistor to each other, a first external electrode disposed on the third surface and connected to the first internal electrode, and a second external electrode disposed on the fourth surface and connected to the resistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.