Batch type plasma substrate processing apparatus
US11183372B2 · kind B2 · utility
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3References
9Claims
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Assignee
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Key dates
| Filing date | Sep 6, 2018 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Jan 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a batch-type substrate processing apparatus which supplies, into a processing space, a process gas decomposed in a separate space. The substrate processing apparatus includes: a tube; a substrate support part; a gas supply pipe; an exhaust part; and a plasma reaction part, wherein the plasma part may include a plurality of power supply electrode parts and a ground electrode part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.