Power electronics module

US11183489B2 · kind B2 · utility

Assignee

• AUDI AG · DE

Inventors

• Andreas Apelsmeier · Pollenfeld, DE
• Johann Asam · Adelzhausen, DE

Key dates

• Filing date: Apr 11, 2018
• Grant date: Nov 23, 2021
• Expiry date: Feb 9, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19104
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power electronics module includes a substrate with a substrate metallization layer, which is separated into conducting areas for providing conducting paths for the power electronics module; a semiconductor switch chip bonded with a first power electrode to a first conducting area of the substrate metallization layer; a conductor plate bonded to a second power electrode of the semiconductor switch chip opposite to the first power electrode.