Embedded substrate voltage regulators
US11183934B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 17, 2019 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Feb 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/83
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Voltage converter inlay modules are provided for embedding within a package substrate, and are configured to supply power to a processor, or similar digital circuit, which is mounted to the package substrate. The package substrate is typically mounted to a circuit board, or similar. The circuit board provides high-voltage, low-current power to the voltage converter module which, in turn, provides low-voltage high-current power to the processor. The voltage converter inlay provides largely vertical current conduction from the circuit board to the processor, thereby reducing conduction losses incurred by lateral current conduction. The location of the voltage converter inlay between the circuit board and the microprocessor minimizes radiation of electromagnetic interference. The number of terminals allocated for providing power to the package substrate may be minimized due to the voltage converter inlay inputting fairly low levels of current. The high-current power required by the processor is constrained within the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.