Method of manufacturing touch structure and touch structure
US11184985B2 · kind B2 · utility
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Key dates
| Filing date | Apr 8, 2018 |
| Grant date | Nov 23, 2021 |
| Priority date | — |
| Expiry date | Sep 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4688
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A touch structure and a method of manufacturing the touch structure are provided. The method includes: forming a first conductive layer on a base substrate; forming a second conductive layer on the first conductive layer; and patterning the first conductive layer and the second conductive layer to respectively form a first conductive layer pattern and a second conductive layer pattern; the first conductive layer pattern is formed after the second conductive layer pattern is formed, and the first conductive layer pattern and the second conductive layer pattern are different from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.