Polyamide moulding compound and moulded articles producible therefrom
US11186716B2 · kind B2 · utility
3Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2016 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Oct 21, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a polyamide moulding compound consisting of an amorphous, microcrystalline or partially crystalline polyamide or mixtures hereof, at least one impact modifier, hollow glass balls and also further additives. The invention likewise relates to moulded articles produced from this polyamide moulding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.