Slurry composition and method of manufacturing integrated circuit device by using the same
US11186749B2 · kind B2 · utility
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4References
18Claims
0Family size
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Key dates
| Filing date | May 20, 2020 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | May 20, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/044
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.