Low-dust products using microcrystalline wax emulsion
US11186752B2 · kind B2 · utility
0Cited by
28References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2019 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Aug 5, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/408
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reducing additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reducing additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reducing additive comprises microcrystalline-wax based emulsion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.