Patent · US Active

Method and apparatus for bending decoupled electronics packaging

US11187073B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

Baker Hughes Holdings LLC · US

Inventors

Carsten Haubold · Celle, DE
Joachim Treviranus · Winsen (Aller), DE
Tim Mueller · Plano, US
Andreas Peter · Celle, DE

Key dates

Filing date	Aug 5, 2016
Grant date	Nov 30, 2021
Priority date	—
Expiry date	Aug 5, 2036

Classification

Technology area (CPC E)Fixed Constructions
CPC primaryE21B17/20
WIPO fieldCivil engineering
WIPO sectorOther fields

Abstract

An apparatus for protecting an electronics module used in a borehole may include an enclosure disposed along a drill string. The electronics module may be attached to the enclosure by at least one joint. The at least one joint allows a predetermined bending between the electronics module and the enclosure that does not mechanically overload the electronics module. In some embodiments, the joint may be a ball joint.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.