Bonded assembly with integrated temperature sensing in bond layer
US11187594B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2019 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Dec 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly, for example an electrostatic chuck assembly, includes a first member, a second member disposed proximate the first member, a bond layer disposed between the first member and the second member, and at least one optical sensor disposed proximate the bond layer to detect a temperature of the bond layer in a field of view of the at least one optical sensor. The bond layer includes a phosphorescent material and provides a dual function of bonding the second member to the first member and emitting phosphorescent radiation towards the at least one optical sensor. In one form, the first member is an electrostatic chuck member and the second member is a heating plate. The assembly may further include a cooling plate and an additional bond layer disposed between the heating plate and the cooling plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.