Sealing glass geometries for sensitivity enhancement of thick-film piezoresistive pressure sensors
US11187605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2019 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Feb 4, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0052
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor assembly, which includes a pressure sensing element having a diaphragm, a plurality of piezoresistors connected to the diaphragm, and at least one layer of sealing glass connected to the diaphragm. The pressure sensor assembly also includes a base, a layer of sealing glass is connected to the base, and is configured to maximize the sensitivity of the plurality of piezoresistors via tailoring the side surfaces of the glass surface to control the deformable diaphragm. The layer of sealing glass includes a first recess portion, and a second recess portion formed as part of the layer of sealing glass on the opposite side of the layer of sealing glass as the first recess portion. One of the plurality of piezoresistors is partially surrounded by the first recess portion, and another of the plurality of piezoresistors is partially surrounded by the second recess portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.