Electronic circuit device and method of manufacturing electronic circuit device
US11189571B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 7, 2020 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Mar 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1453
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The electronic circuit device according to the present invention including the wiring layer 13 including a plurality of the metal wirings, the photosensitive resin layer 21 made of the photosensitive resin arranged on the wiring layer 13, and the first electronic circuit element 33 arranged in the photosensitive resin layer 21. In this electronic circuit device, a plurality of opening 41 for exposing a part of the wiring layer 13 is formed on the photosensitive resin layer 21, and further, together with three-dimensionally connected to the first electronic circuit element 33, the re-distribution layer 42 on the first electronic circuit element including a plurality of the metal wirings which is three-dimensionally connected via a plurality of openings to a part of the wiring layer 13, and the first external connection terminal 51 connected to the re-distribution layer 42 are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.