Display substrate including signal line electrically connected to conductive pattern through the plurality of via holes
US11189646B2 · kind B2 · utility
1Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2019 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Oct 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/481
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A display substrate, a method for manufacturing the same, and a display device are disclosed. The display substrate includes: a base substrate; and a conductive pattern, a first insulating layer and a conductive layer laminated on the base substrate, wherein the first insulating layer has a plurality of first via holes, and the conductive layer includes a signal line, the signal line being electrically connected to the conductive pattern through the plurality of first via holes. The present disclosure may achieve efficient transmission of signals and ensure the display effect of the display device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.