Semiconductor devices and methods of forming the same
US11189694B2 · kind B2 · utility
2Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2019 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Dec 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/834
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A semiconductor device is provided. The semiconductor device includes a semiconductor fin over a substrate, and a gate structure along sidewalls and the top surface of the semiconductor fin. The gate structure covers the first portion of the semiconductor fin. The semiconductor device also includes a source/drain feature adjacent to the gate structure. The semiconductor device further includes a source/drain contact connected to the source/drain feature. The source/drain contact extends downwards to a position that is lower than the top surface of the first portion of the semiconductor fin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.