Light-emitting device and manufacturing method thereof
US11189764B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2019 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Nov 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8511
Abstract
A light-emitting device includes: a base body comprising a resin member, a first lead, and a second lead, wherein the first lead and the second lead are supported by the resin member; a light-emitting element mounted on an upper surface of the base body; a resin frame located on the upper surface of the base body, surrounding the light-emitting element; and a first resin located inside the resin frame to cover a part of side surfaces of the light-emitting element, a part of an inner side surface of the resin frame, and the upper surface of the base body, wherein the first resin includes: a reflection material layer that contains a reflection material, and a resin layer that is located on an upper surface of the reflective material layer and does not contain the reflective material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.