Light emitting diode packages
US11189766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2019 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Jan 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.